H. R. O. Aquino, D. Connelly, A. Orlov, J. Chisum, G. H. Bernstein and W. Porod,
"Design of a Coplanar-Waveguide-Based Microwave-to-Spin-Wave Transducer"
IEEE Trans. Magnetics,
May. 2021 |
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May. 2021 |
H. Aquino, D. Connelly, A. Orlov, J. Chisum, G.H. Bernstein, W. Porod,
"Using Coplanar Waveguides as Spin-Wave Sources with Improved Bandwidth"
2020 Device Research Conference (DRC),
Jun. 2020 |
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Jun. 2020 |
P. Fay, D. J. Kopp, T. Lu, D. Neal, G. H. Bernstein, and J. M. Kulick,
"Ultrawide-Bandwidth Chip-to-Chip Interconnects for III-V MMICs"
IEEE Microwave and Wireless Components Letters 24(1), 29-31, 10.1109/LMWC.2013.2288181,
Jan. 2014 |
|
Jan. 2014 |
Q. Zheng, D. Kopp, M. A. Khan, P. Fay, A. M. Kriman, and G. H. Bernstein,
"Investigation of Quilt Packaging Off-Chip Interconnect with Solder Paste"
IEEE Trans. Components, Packaging and Manufacturing Technology, vol. 4, pp. 400-407,
Mar. 2014 |
|
Mar. 2014 |
P. Fay, D. J. Kopp, T. Lu, D. Neal, G. H. Bernstein, and J. M. Kulick,
"Ultrawide-Bandwidth Chip-to-Chip Interconnects for III-V MMICs"
IEEE Microwave and Wireless Components Letters 24(1), 29-31, 10.1109/LMWC.2013.2288181,
Dec. 2014 |
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Dec. 2014 |