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Citation Research Areas Publication Date
H. R. O. Aquino, D. Connelly, A. Orlov, J. Chisum, G. H. Bernstein and W. Porod, "Design of a Coplanar-Waveguide-Based Microwave-to-Spin-Wave Transducer" IEEE Trans. Magnetics, May. 2021 May. 2021
Q. Zheng, D. Kopp, M. A. Khan, P. Fay, A. M. Kriman, and G. H. Bernstein, "Investigation of Quilt Packaging Off-Chip Interconnect with Solder Paste" IEEE Trans. Components, Packaging and Manufacturing Technology, vol. 4, pp. 400-407, Mar. 2014 Mar. 2014
P. Fay, D. J. Kopp, T. Lu, D. Neal, G. H. Bernstein, and J. M. Kulick, "Ultrawide-Bandwidth Chip-to-Chip Interconnects for III-V MMICs" IEEE Microwave and Wireless Components Letters 24(1), 29-31, 10.1109/LMWC.2013.2288181, Dec. 2014 Dec. 2014
P. Fay, D. J. Kopp, T. Lu, D. Neal, G. H. Bernstein, and J. M. Kulick, "Ultrawide-Bandwidth Chip-to-Chip Interconnects for III-V MMICs" IEEE Microwave and Wireless Components Letters 24(1), 29-31, 10.1109/LMWC.2013.2288181, Jan. 2014 Jan. 2014
H. Aquino, D. Connelly, A. Orlov, J. Chisum, G.H. Bernstein, W. Porod, "Using Coplanar Waveguides as Spin-Wave Sources with Improved Bandwidth" 2020 Device Research Conference (DRC), Jun. 2020 Jun. 2020