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| Citation | Research Areas | Publication Date |
|---|---|---|
| Q. Zheng, D. Kopp, M. A. Khan, P. Fay, A. M. Kriman, and G. H. Bernstein, "Investigation of Quilt Packaging Off-Chip Interconnect with Solder Paste" IEEE Trans. Components, Packaging and Manufacturing Technology, vol. 4, pp. 400-407, Mar. 2014 | Mar. 2014 |