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Citation Research Areas Publication Date
P. Fay, D. J. Kopp, T. Lu, D. Neal, G. H. Bernstein, and J. M. Kulick, "Ultrawide-Bandwidth Chip-to-Chip Interconnects for III-V MMICs" IEEE Microwave and Wireless Components Letters 24(1), 29-31, 10.1109/LMWC.2013.2288181, Jan. 2014 Jan. 2014
Q. Zheng, D. Kopp, M. A. Khan, P. Fay, A. M. Kriman, and G. H. Bernstein, "Investigation of Quilt Packaging Off-Chip Interconnect with Solder Paste" IEEE Trans. Components, Packaging and Manufacturing Technology, vol. 4, pp. 400-407, Mar. 2014 Mar. 2014
P. Fay, D. J. Kopp, T. Lu, D. Neal, G. H. Bernstein, and J. M. Kulick, "Ultrawide-Bandwidth Chip-to-Chip Interconnects for III-V MMICs" IEEE Microwave and Wireless Components Letters 24(1), 29-31, 10.1109/LMWC.2013.2288181, Dec. 2014 Dec. 2014
H. Aquino, D. Connelly, A. Orlov, J. Chisum, G.H. Bernstein, W. Porod, "Using Coplanar Waveguides as Spin-Wave Sources with Improved Bandwidth" 2020 Device Research Conference (DRC), Jun. 2020 Jun. 2020
H. R. O. Aquino, D. Connelly, A. Orlov, J. Chisum, G. H. Bernstein and W. Porod, "Design of a Coplanar-Waveguide-Based Microwave-to-Spin-Wave Transducer" IEEE Trans. Magnetics, May. 2021 May. 2021