P. Fay, D. J. Kopp, T. Lu, D. Neal, G. H. Bernstein, and J. M. Kulick,
"Ultrawide-Bandwidth Chip-to-Chip Interconnects for III-V MMICs"
IEEE Microwave and Wireless Components Letters 24(1), 29-31, 10.1109/LMWC.2013.2288181,
Jan. 2014 |
|
Jan. 2014 |
P. Fay, D. J. Kopp, T. Lu, D. Neal, G. H. Bernstein, and J. M. Kulick,
"Ultrawide-Bandwidth Chip-to-Chip Interconnects for III-V MMICs"
IEEE Microwave and Wireless Components Letters 24(1), 29-31, 10.1109/LMWC.2013.2288181,
Dec. 2014 |
|
Dec. 2014 |