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P. Fay
, D. J. Kopp, T. Lu, D. Neal, G. H. Bernstein, and J. M. Kulick,
"
Ultrawide-Bandwidth Chip-to-Chip Interconnects for III-V MMICs
"
IEEE Microwave and Wireless Components Letters 24(1), 29-31, 10.1109/LMWC.2013.2288181, Jan. 2014
Coplanar waveguides
Insertion loss
Integrated circuit interconnections
Loss measurement
MMICs
Semiconductor device measurement
Transmission line measurements
Jan. 2014