Loss measurement – ND Wireless Institute
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P. Fay, D. J. Kopp, T. Lu, D. Neal, G. H. Bernstein, and J. M. Kulick, "Ultrawide-Bandwidth Chip-to-Chip Interconnects for III-V MMICs" IEEE Microwave and Wireless Components Letters 24(1), 29-31, 10.1109/LMWC.2013.2288181, Jan. 2014 Jan. 2014 P. Fay, D. J. Kopp, T. Lu, D. Neal, G. H. Bernstein, and J. M. Kulick, "Ultrawide-Bandwidth Chip-to-Chip Interconnects for III-V MMICs" IEEE Microwave and Wireless Components Letters 24(1), 29-31, 10.1109/LMWC.2013.2288181, Dec. 2014 Dec. 2014